Rohde & Schwarz invites attendees to Mobile World Congress 2026 in Barcelona to stop by the company’s booth to connect with its experts and to explore solutions for the next generation of wireless technologies.
VIAVI Solutions Inc. announced enhancements to its XEdge cloud-based edge monitoring and assurance platform with new sensors that strengthen data collection capabilities for private 4G, 5G and Wi-Fi networks at the edge.
Signal Hound the release of the VSG200, a 20 GHz vector signal generator (VSG) offering 40 MHz of real-time streaming bandwidth.
Texas Instruments and Silicon Labs announced they have signed a definitive agreement under which Texas Instruments will acquire Silicon Labs for $231.00 per share in an all-cash transaction, representing a total enterprise value of approximately $7.5 billion.
Building on its award-winning portable AI-sensing radar for counter-UAS, MatrixSpace announces a major update to its edge-to-cloud MatrixSpace AI Software Platform.
Siemens announced the acquisition of Canopus AI, an innovator in computational and AI-driven metrology solutions, enabling semiconductor manufacturers to achieve new levels of precision and efficiency in wafer and mask inspection processes.
Gilat Satellite Networks Ltd. announced that it has received an order for over $10 million from a leading ground gateway antenna provider to support the continued rollout of ground infrastructure for a leading LEO constellation.
Kymeta announced a master supply agreement with Japan Display Inc. (JDI) to develop a new next-generation multi-band metasurface aperture to enable concurrent operation across Ku- and Ka-Band satellite frequencies.
Blighter Surveillance Systems has further boosted the stealth characteristics of its e-scan radars to better serve the growing number of developers of crewed and autonomous multi-sensor surveillance vehicles and platforms.
UNIVITY is the first very low Earth orbit (VLEO) constellation fully designed for interoperability, enabling OEMs and tier-one suppliers to integrate space-based connectivity as a simple 5G service, free from proprietary lock-ins and dependence on a single actor.
Samtec, Inc. will showcase high performance interconnect solutions and enabling technologies that support data rates up to 448 Gbps and signals up to 130 GHz in booth #939 at DesignCon 2026
Infineon Technologies AG is expanding its sensor business with the acquisition of the non-optical analog/mixed-signal sensor portfolio from ams OSRAM Group.
Richardson Electronics, Ltd. announced that Rainer Bornwasser has been appointed vice president of Global Sales for Canvys – Visual Technology Solutions, a division of Richardson Electronics
Amphenol RF has introduced a new IP67 FAKRA straight crimp rear mount bulkhead plug into their automotive and industrial portfolio.
Broadcom Inc. announced the industry’s first Wi-Fi 8 access point (AP) and switch solution purpose-built with a unified architecture for AI-ready enterprise networks.
Element Solutions Inc. (ESI) announced the completion of its acquisition of the Micromax conductive pastes and inks business, effective February 2, 2026.
Emerson announced an updated version of NI Nigel™ AI, the industry’s first test-optimized AI technology, as well as new capabilities across its NI LabVIEW+ Suite.
Northrop Grumman is one of the companies selected to receive an award from the Defense Microelectronics Activity (DMEA) for a contracting resource.
Raytheon has been selected by DARPA to develop an advanced sensing and targeting system that will help defend vulnerable commercial shipping and naval logistics vessels against emerging threats such as unmanned surface vehicles.
Rohde & Schwarz expands its portfolio of mid-range instruments with the launch of the R&S FPL1044 spectrum analyzer and a new 40 MHz real-time spectrum analysis (RTSA) option for the entire FPL family.