Microwave Journal Magazine

NHanced Semiconductors announced their new Besi bonding system, further expanding its advanced packaging yield and throughput.

Viasat Inc announced a significant evolution of its network for government customers by unifying Viasat Ka-Band satellites, the Global Xpress satellite fleet, and select partner satellites into a fully integrated global Ka-Band satellite communications network.

KnowMade announced the release of its latest patent landscape report, "LiDAR for Automotive – Patent Landscape Analysis 2025," a comprehensive study capturing how global innovation and intellectual property strategies are shaping the future of LiDAR technologies for ADAS and autonomous vehicles.

Modelithics® announced the release of the Modelithics Qorvo GaN Library v25.5.9. 

Movandi announced its selection under Saudi Arabia’s National Technology Development Program (NTDP) “Relocate” initiative — a flagship national program designed to attract and scale the world’s leading deep-tech companies. 

Slipstream Engineering Design (Slipstream Design) will join the Defence Innovation Accelerator for the North Atlantic (DIANA), an organization established by NATO to find and accelerate dual-use innovation capacity across the alliance.

HENSOLDT is equipping air defence systems from Rheinmetall subsidiary Rheinmetall Air Defence AG with radars from its SPEXER 2000 product family.

Defense Innovation Unit (DIU) announced top-performing solutions for the counter-small unmanned aircraft system (C-sUAS) low-cost sensing (LCS) challenge, with MatrixSpace Inc. selected as the overall winner and will receive the top award of $500k.

The global wireless industry continued its rapid expansion in the third quarter of 2025, with global 5G connections reaching 2.8 billion worldwide, according to data from Omdia and 5G Americas. 

Pico Technology announced the release of PicoScope 7 Software version 7.2.

Keysight Technologies, Inc. announced that in collaboration with KT SAT, it has demonstrated a successful non-terrestrial network (NTN) handover using the KOREASAT-6A satellite at the KT SAT’s Geumsan Satellite Center in Korea.

Indium Corporation announced the global availability of SiPaste® C312HF, a halogen-free, cleanable solder paste formulated for fine-feature printing. 

Sivers Semiconductors AB announced it has been awarded a new development program by the European Space Agency (ESA). 

Amphenol RF announced the introduction of a line of PFAS-free SMA connectors and adapters, expanding their portfolio of high performance RF interconnect solutions. 

The Wireless Broadband Alliance (WBA) published the “WBA Industry Report 2026,” which contains the results of its annual industry survey across the Wi-Fi, cellular and enterprise ecosystem. 

United Microelectronics Corporation (UMC) has announced a licensing agreement with imec for the transfer of imec’s iSiPP300 silicon photonics process, featuring co-packaged optics (CPO) compatibility, to accelerate UMC’s silicon photonics roadmap. 

CEA-Leti and STMicroelectronics presented results at IEDM 2025 showcasing key enablers for a new high performance and versatile RF Si platform cointegrating best-in-class active and passive devices used in RF and Optical FEM.

MatrixSpace announced the availability of its revolutionary Portable 360 Radar™.

With the new R&S NRP150T thermal power sensor, Rohde & Schwarz expands the frequency range of its R&S NRPxT series to 150 GHz.

Anritsu announced the launch of an advanced acoustic evaluation solution for next-generation automotive emergency call systems (NG eCall), developed in collaboration with HEAD acoustics.