Microwave Journal Magazine

Siemens and TSMC Advance AI-powered Semiconductor Design Automation

6 days 7 hours ago
Siemens announced continued collaboration with TSMC to drive innovation in AI-powered automation and advanced semiconductor design enablement. Building on a longstanding relationship within the TSMC Open Innovation Platform® (OIP) ecosystem, the companies are expanding design enablement efforts across semiconductor design workflows to help mutual customers improve productivity, accelerate design cycles and manage increasing design complexity.
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