At Enforce Tac 2026, Aaronia AG demonstrated how its AARTOS DDS platform addresses these evolving threats through a fully integrated approach to detection, analysis and electronic warfare.
Ericsson announced a successful live proof of concept of its integrated sensing and communication (ISAC) technology at the company’s U.S. Headquarters in Plano, Texas, signaling a major step forward in the evolution of networks that both connect and sense the world around them.
Amphenol RF has expanded their precision adapter portfolio with an additional 2.4 mm adapter designed for use in laboratory and production test environments.
Celeste Technologies announced the successful completion of a 5G NR-non-terrestrial networks (NTN) interoperability test campaign at the Qualcomm Technologies, Inc. laboratories in Lannion, France, marking a significant milestone with Sateliot's Payload for the sovereign European low-Earth orbit (LEO) direct-to-device (D2D) constellation.
Gilat Satellite Networks Ltd. announced the successful demonstration of 3GPP-compliant 5G non-terrestrial network (NTN) connectivity over a GEO satellite.
NTT DOCOMO, INC. and Keio University Haptics Research Center announced that they have successfully conducted a demonstration of high-precision remote robot operation over commercial 5G.
Airbus Defence and Space and Greenerwave announce the strengthening of their strategic partnership with the signing of two additional contracts with a total value of several million euros.
Rohde & Schwarz and LITEON collaborate to showcase a production-optimized test setup for high-throughput multi-device testing at MWC Barcelona 2026.
Amphenol Printed Circuits (APC) will be attending and exhibiting at the American Physical Society’s APS Global Physics Summit 2026, March 15-20, 2026 in Denver, Colo.
Samtec’s rugged high-density, high performance interconnects and alignment products were selected for the VITA 90 standard for use on both the plug-in module (PIM) and the backplane enabling a SWaP alternative to 3U OpenVPX.
Amphenol RF introduced 2.92 mm connectors engineered to accommodate 0.141 in. conformable cable enabling stable, low loss high frequency test and instrumentation usage.
Molex has set an industry benchmark for test and measurement with the introduction of Molex Cardinal Multi-Port High Frequency Coaxial Assemblies.
According to a recently published report from Dell’Oro Group, point-to-point microwave transmission equipment revenue ended 2025 on a flat note after posting growth in the first half of the year.
Global Invacom Group Limited has launched a new range of rapid‑deploy XY antenna terminals, designed to deliver fast, reliable multi‑orbit and multi‑band connectivity in the most demanding operational environments.
Rohde & Schwarz will showcase a new milestone in AI-driven wireless system testing at MWC Barcelona.
AntennaWare announced a partnership with SynchronicIT, a module vendor based in the Netherlands.
Skynopy announced that it has been selected as a winner of the Private Sector Study and Aid Fund (FASEP) – Digital Infrastructures program, a financing scheme of the French Ministry of Economy, Finance and Industrial and Digital Sovereignty (Bercy), for the SkyConnect Kenya project, carried out in collaboration with Safran Space.
Taara announced a breakthrough approach to commercial communications and connectivity infrastructure, unveiling Taara Photonics, the world’s first wireless communication platform based on optical phased arrays, along with Taara Beam, its first product based on this photonic core.
Yole Group announced the release of its annual market and technology report, "Status of the Compound Semiconductor Industry 2026 – Focus on Substrates and Epiwafers," highlighting sustained structural growth through 2031.
Teledyne SP Devices’ ADQ35 offers a combination of speed, resolution and flexibility for demanding scientific, industrial and OEM applications.