3 months 1 week ago
Researchers from the Hebrew University of Jerusalem (HU) have discovered that the magnetic component of light plays a significant role in how it interacts with matter, creating new possibilities in optics, spintronics and quantum technologies.
3 months 1 week ago
Blighter has added a proprietary dynamic radar target tracker module to its integrator-friendly BlighterNexus AI-assisted multi-sensor connectivity and processing system.
3 months 1 week ago
Mini-Circuits announced the appointment of Joseph Merenda as the company’s first Research & Development Fellow, marking a significant milestone in the organization’s long-term commitment to engineering excellence and technical innovation.
3 months 1 week ago
KRYTAR, Inc. announced a new 2-way power divider offering high performance over the broadband frequency range of 7.125 to 15.35 GHz (C- through Ku-Bands) in a compact package.
3 months 1 week ago
Open Cosmos has achieved a major breakthrough with the successful deployment into orbit of two key platforms: 6GStarLab, the first in-orbit telecommunications laboratory and a new satellite of the Open Constellation contributed by a Fortune 100 company.
3 months 1 week ago
Marki Microwave announced it has been acquired by Industrial Growth Partners (IGP), a San Francisco-based private equity firm providing transformative capital for the industrial market.
3 months 1 week ago
Taoglas® announced the expansion of its embedded antenna portfolio with a new range of low temperature co-fired ceramic (LTCC) chip antennas optimized for Wi-Fi® 6/7, ultra-wideband (UWB) and ISM connectivity.
3 months 1 week ago
Anywaves announced the creation of a new U.S.-based subsidiary, Anywaves Federal, focused on government and defense customers.
3 months 1 week ago
According to a recently published report from Dell’Oro Group, total global revenue for the broadband access equipment market decreased to $4.5 billion in 3Q 2025, down 3 percent Q/Q and 5 percent Y/Y.
3 months 1 week ago
Novocomms has secured £1.5 million of funding from Innovate U.K. (on behalf of the Department for Science, Innovation and Technology) to develop novel switch solutions that will deliver ultra-high speed wireless access.
3 months 1 week ago
Revenue for Rohde & Schwarz rose by 7.8 percent to EUR 3.16 billion, exceeding the three-billion-euro mark for the first time in the group's history.
3 months 1 week ago
At the Forum Innovation Défense (FID), Greenerwave showcased, alongside the French Defence Procurement Agency (DGA) and the French Defence Innovation Agency (AID), the major advances achieved within the m3SFA program, selected as one of the success stories of the 2025 edition.
3 months 2 weeks ago
Peraso Inc. announced a collaboration with Virewirx Inc. to provide its 60 GHz Perspectus™ modules to power the Virewirx VX60 platform.
3 months 2 weeks ago
COMSOL announced the release of COMSOL Multiphysics® version 6.4, which introduces new features, major performance improvements and expanded capabilities for multiphysics modeling and simulation app development.
3 months 2 weeks ago
Yole Group announced the release of its new technology and market report, Glass Materials for Semiconductor Manufacturing 2025, a comprehensive study analyzing the rapid rise of glass as a strategic material in semiconductor processes and permanent device architectures.
3 months 2 weeks ago
Würth Elektronik expands its range of FeatherWing development boards to include the Daphnis-I FeatherWing Board.
3 months 2 weeks ago
Quantic PMI has earned the ISO 9001:2015 and AS9100D certifications for its quality management system for its Frederick, Md., and El Dorado Hills, Calif., facilities.
3 months 2 weeks ago
Sivers Semiconductors announced a new collaboration with Doosan Corporation to develop scalable electronically steerable array (ESA) panels in the Ka-Band for satellite communications.
3 months 2 weeks ago
ZTE Corporation and MTN South Africa, have announced three major innovations that will transform network performance and customer experience.
3 months 2 weeks ago
congatec announced a technology collaboration with Qualcomm Technologies, Inc. that will speed the commercialization of high performance embedded edge AI applications for SWaP constrained industrial products based on Qualcomm Dragonwing™ processors.
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