The IEEE Electronic Components and Technology Conference (ECTC) has extended the deadline for the Student Innovation Challenge for ECTC 2026.
YINCAE Advanced Materials will showcase its latest wafer-level packaging solutions at the Wafer-Level Packaging Symposium, taking place February 17–19, 2026, in San Francisco, Calif., USA.
The Z-Wave Alliance announced the continued expansion of Z-Wave Long Range (ZWLR) certification across the ecosystem.
Sony Semiconductor Israel (Sony) announced its long-term vision for 5G IoT connectivity, positioning eRedCap (enhanced Reduced Capability) as the foundation for the next generation of global, long-life connected Altair devices.
Leonardo DRS, Inc. announced that John Baylouny has officially assumed the role of president and chief executive officer, effective January 1, 2026.
Professor André Vander Vorst passed away peacefully on December 25, 2025, after a long and distinguished life devoted to science, education and service to the international microwave community.